Beth PaquetteAerospace Engineer at Goddard Space Flight Center
Beth Paquette is a mechanical engineer in the Parts, Packaging and Assembly Branch at the National Aeronautics and Space Administration (NASA) Goddard Space Flight Center (GSFC). She received her Bachelor’s Degree in Mechanical Engineering from the University of Delaware and my Master’s Degree in Mechanical Engineering, with a specialization in electronics packaging, from the University of Maryland, College Park. She gained experience in engineering from her time at AAI Corporation, Gichner Shelter Systems, Raytheon Integrated Defense Systems, and Refractory Composites, Inc. Her experience includes medical device manufacturing, high-temperature preform manufacturing, unmanned aircraft systems, electronic modular enclosure design, tooling design, and lead-free solder reliability testing. Her career at NASA began in September 2010 and since then she has worked on ceramic column grid array (CCGA) assembly evaluations, the development of a NASA lead-free control plan, connector tooling design, electronic packaging design, integration & test, finite element analysis, solder reliability testing, and miniaturized electronics development.